ASE Technology engages in outsourced semiconductor assembly and test services (OSAT). Positioned at the backend of the semiconductor supply chain, the company receives bare silicon wafers from fabless chip design companies, applying physical processes such as wire bonding, flip-chip, and system-in-package (SiP) to protectively encapsulate them and attach electrical pins, while conducting electrical performance screening. The processed finished chips are subsequently shipped in batches to major electronic device foundries for final assembly.